Mainly used for 3C consumer electronics small board parts processing
Mainly used for 3C consumer electronics small board parts processing
Different materials: steel, copper, aluminum, graphite, plexiglass, etc. can be precisely processed
Specially developed for customers who have high-precision and high-finish requirements for processed products
Drilling and tapping processes for large-size non-ferrous metals, frames, profile parts, etc
Mainly used for 3C consumer electronics small board parts processing
Mainly used for 3C consumer electronics small board parts processing
Pansea Seiki
Pansea Smart
